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Reinforcing silicone with hemp fiber for additive manufacturing

Title:

Reinforcing silicone with hemp fiber for additive manufacturing

Koushki, P., Kwok, Tsz Ho ORCID: https://orcid.org/0000-0001-7240-1426, Hof, L. and Wuthrich, Rolf (2020) Reinforcing silicone with hemp fiber for additive manufacturing. Composites Science and Technology, 194 . ISSN 02663538

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Official URL: https://doi.org/10.1016/j.compscitech.2020.108139

Abstract

This study explores the 3D printability of a new material based on silicone and hemp fibers from renewable, sustainable and non-petroleum resources with the aim of enhancing mechanical properties of silicone. Incorporation of fibers improved the mechanical properties of the silicone matrix, but it also adversely affected the printability of silicone due to the high viscosity. Therefore, an additional solvent is added into the composition to alter the viscosity. To mature the composite printing technology, this research aims to find out the desired mixing composition of silicone, hemp fiber, and solvent. The behavior of the new engineered material was analyzed using rheological study to obtain a printable material. The composition containing 15 wt% hemp fibers and 20 wt% solvent with enhanced mechanical properties displayed the desirable printability. Moreover, the mechanical properties of the 3D printed and molded samples were studied. The results revealed that 3D printed samples outperformed the molded counterparts. Finally, a honeycomb structure and a simple gripper were fabricated to demonstrate the application of the developed material.

Divisions:Concordia University > Gina Cody School of Engineering and Computer Science > Mechanical, Industrial and Aerospace Engineering
Item Type:Article
Refereed:Yes
Authors:Koushki, P. and Kwok, Tsz Ho and Hof, L. and Wuthrich, Rolf
Journal or Publication:Composites Science and Technology
Date:July 2020
Digital Object Identifier (DOI):10.1016/j.compscitech.2020.108139
ID Code:992292
Deposited By: Tsz Ho Kwok
Deposited On:12 Jun 2023 15:33
Last Modified:12 Jun 2023 15:33
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