Abstract

Additive manufacturing (AM) technologies can be used to manufacture metallic and non-metallic
parts. Combination of electrochemistry and additive manufacturing technology makes possible the
fabrication of different shapes and geometrical features with very smooth surfaces.
In this thesis, an overview of the basics of electroless copper plating, copper electroplating, AM technologies and their applications are covered. An introduction to how an AM part is produced, how electroless copper plating is carried out on a non-conductive surface, how an electroless copper plated part can be electroformed, how to obtain sufficient thickness of the copper coating while keeping the surface smooth have been shown.
FDM (fused deposition modeling) technology is used to print a 3D ABS (Acrylonitrile butadiene styrene) part due to its low manufacturing cost and a minimal amount of waste material. Then, a
produced ABS part got conductive through electroless copper plating process enabling the electroplating afterward.
Optimal parameters of electroless copper plating and copper electroplating (in three different modes: galvanostatic, potentiostatic and pulse-potentiostatic) on a planar geometry are achieved with the goal of obtaining a smooth surface.
The results show that the surface roughness of a produced 3D metallic part can be significantly lowered using pulse electrodeposition. Although the presence of additives in the solution can affect the surface roughness and properties of the deposit, using pulse electroplating technique is offered as an alternative to the additives which are almost toxic, and add impurities within copper deposit.